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Picture of Teradek Bond HEVC Backpack AB-Mount Japan
Picture of Teradek Bond HEVC Backpack AB-Mount Japan
Picture of Teradek Bond HEVC Backpack AB-Mount Japan
Picture of Teradek Bond HEVC Backpack AB-Mount Japan
Picture of Teradek Bond HEVC Backpack AB-Mount Japan
Picture of Teradek Bond HEVC Backpack AB-Mount Japan

Teradek Bond HEVC Backpack AB-Mount Japan

The Bond 759 HEVC Backpack from Teradek includes the Bond 757 Expansion Module with Cube 755 Encoder, a Node Cellular 4G LTE USB Modem (Japan), and an AB-mount battery plate.
Manufacturer: Teradek
Availability: Available in 7-10 days
SKU: TER-10-0759-JPG
MPN: 10-0759-JPG
R181 939,20
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